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 Sr Mechanical / Thermal Engineer for LED Lighting - Danvers, Massachusetts, United States

Job Information
Posted by: OSRAM SYLVANIA 
Hiring Entity type: Manufacturing 
Work Authorization: Not Specified for United States
Position Type: Direct Hire, Full-Time 
Compensation: ******
Benefits:
Relocation: Relocation assistance provided 
Position Functions: Engineering - Mechanical
Manufacturing
Science
 
Travel: Minimal 
Accept candidates: from anywhere 
Languages: English - Fluent
 
Minimum Education: Bachelor Degree 
Minimum Years Experience: N/A 
Resumes accepted in: English
Cover Letter: No cover letter requested
Job Code: 3475 / Latpro-1767644 
Date Posted: Jul-30-2008
State, Zip: Massachusetts, 01923

Description

Join an entrepreneurial and cross-functional team at the cutting-edge of LED lighting. Perform research and advanced development of LED systems/ components to develop novel and highly efficient LED lighting solutions with a high quality of light. The candidate will research, designs and develop mechanical as well as thermal management solutions to novel LED lighting systems. He or she will work in a cross functional team, conceive and evaluate the feasibility of advanced concepts, and assist in bringing these concept into product development.

If you are enthusiastic about the new possibilities in LED lighting, entrepreneurial and highly innovative, have a can-do attitude, are a team player and a resourceful problem solver, and comfortable in a fast-moving and highly dynamic environment - come and join us!


Requirements


- MS or PhD in Mechanical Engineering or a related engineering field

- 0-5 years of experience

- Proficiency in mechanical, thermal (FEA) design and material selection of complex die cast metal and plastic parts, sheet metal components, harness design and layout of the mechanical requirements for printed circuit board (PCBs)
-Generate engineering documentation such as BOM's, schematics, qualification reports, FMEA's

- Modeling and drafting of designs to include: Solidworks, Cosmosworks and/or CosmosFlowWork or equivalent FEA experience in Thermal Modeling or Simulation Analysis

- Candidates are preferred with some of the following additional experiences: Hands-on experience with die bonding, reflow processes, wirebonding flip-chip bonding, for prototyping and experience with high-speed electronic packaging for manufacturing

 

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